Backlit LED Panels, LED Downlight Manufacturers

How to avoid common quality problems such as bubbles, yellowing, and difficulty in demolding during the production of backlight LED panels?
1. Bubble problem
The generation of bubbles is usually related to uneven material mixing, unreasonable mold design, or improper injection molding process. To avoid this problem, we have taken the following measures:
Material selection and pretreatment: Select high-quality LED backlight materials and light diffusers to ensure that the materials are dry and free of impurities. Before injection molding, fully preheat and mix the materials to ensure uniform distribution of the materials.
Mold design: Optimize the mold structure to ensure that the gate position is reasonable and avoid dead corners and bubble retention areas. The mold surface is polished with high precision to reduce the adhesion of the material in the mold and facilitate the discharge of gas.
Injection molding process control: Accurately control the injection molding temperature, pressure and speed to ensure that the material flows evenly in the mold. Using a multi-stage injection molding process, first fill the mold at low speed and low pressure, and then compact the material at high speed and high pressure to effectively reduce the generation of bubbles.
2. Yellowing problem
Yellowing is usually caused by material aging, ultraviolet radiation or high temperature. In order to maintain the long-term brightness and color stability of the LED panel, we have taken the following measures:
Material selection: Select high-performance materials that are UV-resistant and aging-resistant to ensure that the materials are not prone to yellowing during long-term use.
Production process optimization: During the injection molding process, strictly control the mold temperature and cooling time to avoid accelerated aging of the material due to high temperature. Use nitrogen protection injection molding process to reduce the contact between oxygen and materials and further delay yellowing.
Post-processing: Anti-ultraviolet treatment of the finished product, such as coating with anti-ultraviolet coating, to enhance the weather resistance of the product.
3. Difficult demoulding problem
Difficult demoulding may be caused by improper mold design, inconsistent material shrinkage or mold surface contamination. To solve this problem, we have taken the following measures:
Mold design optimization: Ensure that the mold draft angle is reasonable to avoid sharp angles and dead corners. The mold surface uses wear-resistant and corrosion-resistant materials to reduce mold surface contamination and wear.
Material selection and process control: Select materials with consistent shrinkage to ensure that the material shrinks evenly during the cooling process. Accurately control the injection molding pressure and cooling time to avoid the material from being difficult to demould due to uneven shrinkage.
Mold maintenance: Clean and maintain the mold regularly to ensure that the mold surface is clean and smooth, which is conducive to the smooth demolding of the product.

LED downlights generate heat when working. How does your company design the heat dissipation system to ensure the normal operation of the LED chip and extend its service life?
1. Heat conduction design
Heat dissipation substrate: Use an aluminum substrate or copper substrate with a high thermal conductivity as the carrier of the LED chip to quickly conduct the heat generated by the chip to the heat sink.
Thermal interface material: Apply high thermal conductivity thermal grease or thermal conductive gel between the LED chip and the heat dissipation substrate to reduce thermal resistance and improve heat conduction efficiency.
2. Thermal convection design
Heat sink structure: Design a reasonable heat sink structure, such as fin type, pin fin type or spiral type, to increase the heat dissipation area and improve heat dissipation efficiency. The surface of the heat sink is anodized or sandblasted to enhance the heat dissipation performance and aesthetics of the heat sink.
Fan or air duct design: When necessary, use a fan or design an air duct to use air convection to take away the heat on the heat sink and further reduce the temperature of the LED chip.
3. Thermal radiation design
Surface radiation treatment: Special treatment is performed on the surface of the radiator, such as coating with a radiation coating, to enhance the thermal radiation capacity of the radiator.
Material selection: Materials with high emissivity are selected to make the radiator to improve the thermal radiation efficiency of the radiator.
4. Intelligent temperature control system
Temperature sensor: A temperature sensor is installed inside the LED downlight to monitor the temperature of the LED chip in real time.
Intelligent control: According to the feedback from the temperature sensor, the power of the LED is intelligently adjusted or the cooling fan is turned on to ensure that the LED chip always works within the optimal temperature range.